ECCOBOND A401电子组装ECCOBOND A401电子组装//ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/ECCOBOND A401电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND A401 is a rigid thermally conductive adhesive
recommended for the assembly of components that require
thermal management. It contains aluminum oxide filler and is a
Class F (155°C) insulator with 100% solids.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , mPa•s (cP) 85,000
Specific Gravity 1.65 to 1.75
Shelf Life:
@ 40oC, weeks 2
@ 25oC, months 2
@ 0oC, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 120°C or
30 minutes @ 140°C or
15 minutes @ 160°C or
5 minutes @ 180°C
NOTE: No adverse exotherm effects when cured at 100°C in masses
up to about 200 grams.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 0 °C
ECCOBOND A401是一种刚性导热胶
推荐用于组装需要的组件
热管理。它含有氧化铝填料，是一种
F（155°C）绝缘子，100％固体。
固化材料的典型特性
粘度，布鲁克菲尔德，mPa•s（cP）85,000
比重1.65〜1.75
保质期：
@40oC，周2
@25oC，月2
@0oC，月6
闪点 - 参见MSDS
典型的固化 |
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