HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/HYSOL QMI529HT电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
QMI 529HT is a highly silver filled, conductive adhesive
designed to provide high (6-7 W/m°K) thermal conductivity and
excellent electrical conductivity for attachment of integrated
circuits and components to metallic leadframes. The material
is hydrophobic and stable at high temperatures. These
features produce void-free bond lines with excellent adhesive
strength to a wide variety of metals and ceramic surfaces,
including copper, silver-plated copper, preplated leadframes
(NiPdAu) and Alloy 42. A package or device manufactured
with QMI 529HT will have high resistance to delamination and
popcorning after multiple exposures to lead-free solder reflow
temperatures. The QMI 529HT is designed to achieve UPHs
several orders of magnitude higher than conventional oven
cured adhesives. Maximum productivity is realized through inline
cure, either on the diebonder using a post diebond heater
or on the wirebonder preheater.
“This product and its use may be covered by patent 5,717,034 and by
one or more pending patent applications.”
TYPICAL APPLICATIONS
This product was developed as soft-solder replacement or for
applications that require higher thermal or high electrical
conductivity.
STORAGE AND HANDLING
QMI 529HT is supplied in syringes and should be stored at
-40°C. Please review 汉高’s current Die Attach Handling
Procedure for additional details on thawing and usage.
产品描述
QMI 529HT是一种高度充满银色的导电胶
旨在提供高（6-7 W / m°K）导热性和
优良的导电性用于附件的集成
电路和组件到金属引线框架。材料
在高温下具有疏水性和稳定性。这些
特征产生具有优异粘合剂的无 |
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