用途
主要供给高阶IC使用如在ASIC等高功能芯片,主要使用于计算机的MPU或通信设备等里面。
材料
主体是多层共烧氧化铝陶瓷、以铜/银焊接(Brazing)的方式安装上铁•镍•钴合金等的Pin端子
特征
通过陶瓷多层配线的结构形成细微的配线电路，可对应电气特性的多功能化，并能形成一集成的内置电容；外部端子除了可对应插座贴装用以外也可支持小节距的表面贴装，可支持400 pin以上或更多的外部端子的要求。
Pin grid array (PGA)
Application
This package is equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a computer and communications equipment.
Material
The main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of iron, nickel, and cobalt are attached with silver-brazing to the main body.
Features
This package, in which there are ultra-fine wiring circuits created based on a ceramic multilayer wiring structure, supports multifunctional electric properties and can create an integrated built-in capacitor. The external terminal is used not only for socket installation but also supports a fine pitch for surface installation. In addition, it can support cases where external terminals with 400 pins or more is needed. |
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